Responsibilities：
Lead system engineering activities for new product introduction (NPI), including SoC definition, hardware system design, PISI, bring-up, debugging, validation, technical documentation, reference schematic/layout design, and application note preparation.
Own and drive cost effective reference platform design.
Provide customer support and technical enablement, including training, demo/prototype bring-up, onsite troubleshooting, technical presentations and workshops.
Manage and deliver multiple NPI and customer projects in parallel under aggressive schedules.
Requirements：
Bachelor’s degree in electrical engineering with 7+ years hardware board design experience.
Independent experience in system board design with Cortex-A5x/A7x.
Independent design experience with PMIC、DC-DC、LDO power systems.
Strong PCB layout expertise including material selection, dielectric/stackup, SI/PI principles, and HDI high speed layout.
Hands on experience with signal integrity (SI) and power integrity (PI) analysis.
Familiarity with PCBA manufacturing processes including DFM, EMI/ESD, thermal design, and testing.
Proficient in high-speed interface design and validation: DDR, LPDDR4, LPDDR5/5x, eMMC, QSPI, PCIe4.0, USB3.0 (with/without PD), Ethernet, etc.
Skilled at Cadence OrCAD / Allegro.
Experience with EMI/EMC compliance is a plus.
Understanding SI theory; familiarity with Cadence Sigrity, HyperLynx or similar simulation tools is a plus.
Familiar with diagnostic tools such as logic analyzers, oscilloscopes, protocol analyzers, etc.
Strong communication skills in both English and Chinese.
Demonstrated ability to drive technical issues to close.
Detail oriented, patient, responsible, with strong initiative and willingness to learn.
Capable of working under very tight project schedules.
Strong teamwork and independent work capability.
Excellent presentation skills.
Experience in embedded software is preferred.
Familiar with Microsoft Office, Visio, PowerPoint.
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