Eliyan Corporation

Eliyan Corporation is a leading innovator in the chiplet revolution, focusing on the critical challenge of scaling semiconductor performance, size, power, and cost to meet the demands of high-performance computing. Their breakthrough technology, NuLink™, enables the industry's highest performing interconnect for multi-die architectures, using both standard and advanced packaging. This allows for the creation of larger, more powerful systems-on-package (SiPs) with significant performance and power advantages. Eliyan's approach is designed to address the growing need for efficient and cost-effective multi-die integration in a wide range of applications, including AI, HPC, and automotive.

Eliyan has garnered considerable attention and investment from industry leaders, including Intel Capital, Micron Ventures, Samsung Catalyst Fund, Tiger Global Management, and VentureTech Alliance. Their technology is compatible with industry standards like UCIe and BoW, and they have successfully taped out their NuLink™ PHY in advanced process nodes, achieving industry-leading performance and power efficiency. With their continued focus on innovation and collaboration with key stakeholders, Eliyan is well-positioned to shape the future of the chiplet ecosystem and drive the advancement of high-performance computing.

Eliyan Corporation is leading the chiplet revolution, focusing on solving the fundamental challenge of scaling semiconductor performance, size, power, and cost to meet the needs of high-performance computing applications. They have developed a breakthrough method to enable the industry's highest performing interconnect for homogeneous and heterogeneous multi-die architectures using both advanced and standard packaging substrates. Eliyan's mission is to enable increased sustainability through cost reduction, manufacturing waste minimization, and lower power consumption in the chiplet ecosystem.

Eliyan promotes a culture of innovation and collaboration, driven by a passion for pushing the boundaries of semiconductor technology. The company's commitment to developing cutting-edge solutions is evident in their pioneering work in chiplet interconnect and their focus on solving the industry's most challenging problems. This culture is fostered by a team of experienced and accomplished engineers, as well as a strong commitment to industry standards and collaboration with leading organizations like OCP and UCIe.